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Facilities

The CMU MRSEC supports three Shared Experimental Facilities:

  1. Orientation Imaging Microscopy Laboratory (OIM)
  2. Surface Preparation and Analysis Laboratory
  3. Scanning Auger Electron Microscopy Laboratory

Orientation Imaging Microscopy Laboratory (OIM)

The OIM consists of a Philips XL40 FEGSEM, equipped with a large specimen chamber and a Peltier cooled CCD camera for acquisition of electron backscattering patterns. The camera mount has also been upgraded to a stepper motor driven screw drive, allowing the camera position to be controlled to meet the diffraction requirements of the experiment. Recently, provisions for fitting a hot stage to run in-situ annealing and orientation data acquisition experiments have been implemented, and have been preliminarily successful. Data collection is provided by commercial OIM software acquired from TSL, and runs on a windows PC workstation. The OIM is part of the Earl and Mary Roberts Materials Characterization Laboratory that houses the department's X-ray and microscopy facilities. The MCL also contains a classroom from which students can remotely control the microscopes.

Surface Preparation and Analysis Laboratory

The Center's research demands state-of-the-art sample surface preparation. Our experiments rely on the ability to prepare very flat, polished surfaces, and to remove very thin sections with a high degree of parallelism. To meet these demands, we have assembled several kinds of polishing, lapping and precision milling instruments. For sectioning of soft metals we have installed a diamond-milling system (Reichert-Jung Polycut E with Ultramiller) capable of the precision removal of ~1 micon layers. A precision spindle polishing machine (Strasbaugh Polishmaster) can be used for mechanical polishing of metal and ceramic samples. We have also acquired a Logitec lapping and polishing system which provides much more rapid polishing action (in comparison with the Strausbaugh polisher) while still maintaining excellent parallelism. Using the Logitec system, we are able to polish samples flat to within ± 0.5 microns over distances of 1 cm and are able to remove thicknesses as small as 5 microns. The facility also includes optical microscopes, an electropolisher for the finishing of metallic specimens, and an inductively coupled gauge head to determine sample parallelism and the thickness of removed layers.

The atomic force microscope capabilities in this facility have recently been extended so that we can map large areas of the sample surface both by contact AFM and by optical microscopy. This is accomplished with the ThermoMicroscopes M5 microscope. The optical mapping capability is useful for establishing real space maps of grain boundary positions. By combining these images with OIM data, we are able to construct the high resolution orientation maps needed to measure the five parameter grain boundary distribution. The M5 also features programmable stage motion for automated data collection via AFM. This has been employed to collect very large data sets over extended periods with minimal user interaction.

Scanning Auger Electron Microscopy Laboratory

This facility consists of a PHI Model 600 scanning Auger microprobe (SAM). Recently, the instrument was upgraded with a modern PC based computer, new controlling electronic modules, and new software that improves our capabilities to acquire, process, and transmit the data. In early 2003, we plan another software upgrade that will increase the number of acquisition points, from 40 to 1000, in the Multiplex mode. This mode allows acquisition of semi-quantitative elemental compositions at specific points on the sample surface. This will be especially useful for our study on GBs segregation, where a wide range of GBs have to be chemically analyzed on fracture surfaces.

facilities at MRSEC.org: A listing of facilities at other universities that are part of the national network of Materials Research Sceince and Engineering Centers.

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